Recent #2nm process news in the semiconductor industry
➀ TSMC is scheduled to start producing 2nm GAA wafers in the fourth quarter of 2025 at its Fab 20 factory in Hsinchu, with a capacity of 30k wpm, followed by the Fab 22 factory in Kaohsiung, also with a capacity of 30k wpm, starting production in the first quarter of 2026.
➁ N2P production will begin at the end of 2026, but without the previously announced backside power delivery.
➂ The N2 and N2P processes will use TSMC's NanoFlex technology, allowing chip designers to mix and match units from different libraries (high-performance, low-power, area-efficient) on the same design.
➀ Samsung Electronics has begun developing the next-generation Exynos for the Galaxy S27, aiming to recover its self-respect in the mobile application processor (AP) market.
➁ The new Exynos product, codenamed 'Ulysses,' will be produced using Samsung's second-generation 2nm process, SF2P, which is expected to be mass-produced in 2026.
➂ The development of the chip is crucial for Samsung's foundry competitiveness, as it seeks to regain its position in the advanced 2nm process market after losing the 3nm market to TSMC.